Microsoft announced a major breakthrough in cooling technology with the development of in-chip microfluidics.
This system channels liquid coolant directly into silicon chips to remove heat up to three times more effectively than current cold plate systems.
Coolant flows directly onto hot spots by etching microscopic grooves into the chip’s surface, keeping AI chips significantly cooler while reducing energy demands.
Microsoft also used AI to identify unique heat signatures, ensuring that coolant is applied efficiently.
This innovation is expected to unlock new possibilities for AI infrastructure, from enabling denser datacenter layouts to supporting future 3D chip architectures that would otherwise overheat with traditional cooling.
With AI workloads generating unprecedented levels of heat, Microsoft says microfluidics is critical for advancing sustainability, reducing operational costs, and powering the next era of AI-driven services.
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